Plasma Emission Monitor Control
Download Plasma Emission Monitor Brochure Here in Hi Res - PEM Closed Loop Control pdf

The NLE Plasma Emission Monitor builds on the advancements of the NLE Voltage Controller, adding an optical sensor to precisely control reactive plasma processes with standard or non-traditional hysteresis curves such as TiO2, ITO, and AZO. Designed by process engineers for process engineers, this system regulates voltage to eliminate guesswork, increase sputter rates by a measure of 5X or more, and achieve high-quality films.

The NLE Plasma Emission Monitor allows you to rapidly sputter high-quality, compound films that have standard or non-standard hysteresis curves such TiO2, ITO, and AZO. Based on optical emission sensor feedback, the system carefully manages the balance of power and reactive gas flow by adjusting the reactive gas setpoint. Precisely maintaining the partial pressure reactive gas improves film stoichiomentry while increasing sputter rates five times or more over fixed-flow control. In addition, your process will become more efficient, reducing incoming power requirements as well as cathode and substrate temperatures—helping to avoid both damage to the target and to the magnets. Even during heavy arcing events, you can achieve uniform film thickness and produce more deposition runs before the end-of-target life.
Engineered for easy installation, configuration, and operation, the NLE Plasma Emission Monitor has an intuitive, touch-screen management interface. A Profibus or DeviceNet® communication interface also comes standard for remote control and custom data logging capabilities.
The complete system includes:
• Rack-mount voltage control unit
• Fast MFC
• Intuitive software
• Cables, fiber optics, and vacuum feedthrough
• Photomultiplier tube and filter
• Collimator

Stabilize reactive gas processes, including those with non-standard hysteresis curves, such as TiO2, ITO, and AZO
Increase your sputter rate up
to 5X or more for higher yield and throughput
Reduce incoming power requirements
Prevent target poisoning, increase target utilization, and run your process longer to end-of-target life
Reduce arcing
Eliminate unnecessary hassle with an easy-to-use, reliable, and rugged system
| This page was updated on January 04, 2012 |
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by DRProductions |